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Chinese language media outlet ijiwei.com reported on Wednesday that BYD’s chip-making arm BYD Semiconductor has put into manufacturing an 8-inch automobile persistent chip venture in japanese China’s Shandong province, with a deliberate annual manufacturing capability of 360,000 wafers.
“The venture will lend a hand ease the lack of high-power chips for brand spanking new power automobiles (NEVs). It used to be put into manufacturing in January this yr and is predicted to succeed in complete design capability within the subsequent yr or so,” stated Li Haitao, deputy basic supervisor of BYD Semiconductor’s Jinan department.
BYD Semiconductor’s primary trade covers R&D, manufacturing and gross sales of persistent semiconductors, built-in circuits, clever sensors and optoelectronic semiconductors. BYD without delay holds 72.3% of the corporate’s stocks, making it the controlling shareholder. In January this yr, BYD Semiconductor’s plan to move public within the A-share marketplace used to be licensed via native regulators. It has 5 subsidiaries positioned in Ningbo, Guangdong, Changsha, Xi’an and Jinan.
SEE ALSO: BYD Begins Purchasing IGBT Modules From Providers Different Than Its Semiconductor Unit
In step with Omdia’s public information, in 2019, the marketplace proportion of BYD’s insulated gate bipolar translator (IGBT) for motor power controller reached 18%, rating 2d on the earth and primary in China. Even so, the manufacturing capability is enough for BYD’s surging NEVs gross sales. In 2021, BYD offered 593,745 NEVs, up 231.6% year-on-year from 189,700 devices in 2020. As well as, BYD forecasts that its gross sales of NEVs will succeed in 1.5 million devices in 2022.